Semiconductor Wafers and Devices
Cognex solutions support the wafer and semiconductor device manufacturing process
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Cognex machine vision solutions are essential to every step of the semiconductor device manufacturing process, from wafer fabrication to integrated circuit (IC) packaging and mounting. Cognex tools handle a range of integrated circuit (IC) package types, including leaded parts, system-on-chip (SoC), and microelectromechanical system (MEMS) devices and provide traceability throughout assembly. Vision tools locate features of wafers, dies, and packages under extremely challenging conditions and can detect low contrast and noisy images, variable fiducial patterns, and other part variations.
Cognex supports a wide range of applications in the wafer and semiconductor device manufacturing process, including:- Wafer, die and probe tip alignment
- Metrology
- Coating quality inspection
- Identification and traceability
Wafer Processing, Inspection, and Identification
Machine vision performs alignment, inspection, and identification to help manufacture high quality wafers used in integrated circuits (ICs) and other semiconductor devices. Machine vision automates wafer handling, enables precision alignment, inspects bond pads and probe tips, and can measure critical dimensions of crystalline structures.
Die Quality: Dicing Guidance, Inspection, Sorting, and Bonding
After wafer processing is complete, dies are separated from their wafers and are sorted into categories based on various qualities. Vision systems guide the dicing saw, and vision tools locate cracks and chips that affect die quality. Inspections verify resistor markings and assess LED color quality and brightness. Dies that have been successfully sorted are then bonded to their packages.